The Impact of the U.S. Chip Act and the Chip4 Alliance, and China How to Respond It
Keywords:
U.S. Chip Act; Chip4 Alliance; China's Response Strategy.Abstract
On August 9, 2022, local time, U.S. President Biden officially signed the Chip and Science Act. Prior to signing this act, the U.S. proposed the formation of a so-called "Quad Alliance" consisting of the United States, Japan, South Korea, and Taiwan. This move was aimed at fostering alliances with countries with strong semiconductor industries and collaborating with other nations to suppress semiconductor development in mainland China. However, it is important to note that China has a large domestic market, which may not be completely suppressed by the "Quad Alliance" in terms of semiconductor development.
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References
Chen, K. (2022). What Does the Signing of the "Chip Act" Mean? [J]. China Report, 2022(09).
Chinese Association for Science and Technology Innovation Strategy. Innovation Research Report, Issue 62 (Total Issue 490) [R]. Beijing: Chinese Association for Science and Technology Innovation Strategy, 2021.
Semiconductor Industry Association, Boston Consulting Group. Strengthening Global Semiconductor Supply Chains in Uncertain Times [R]. United States: Semiconductor Industry Association, Boston Consulting Group, 2021.
Tan, X. (2022). The "Chip Act" in the United States: Aimed at Containing China, But Ultimately Self-Destructive [J]. World Knowledge, 2022(17).
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