WANG, Chunmei; LU, Yunxiang; SURNAME, Mengdie Wu. Numerical Simulation of Tantalum Capacitor Reflow Soldering in Temperature Field. Transactions on Computer Science and Intelligent Systems Research, [S. l.], v. 1, p. 128–133, 2023. DOI: 10.62051/zyzw5n25. Disponível em: https://wepub.org/index.php/TCSISR/article/view/93. Acesso em: 21 jul. 2026.