Numerical Simulation of Tantalum Capacitor Reflow Soldering in Temperature Field
DOI:
https://doi.org/10.62051/zyzw5n25Keywords:
Thermal Stress; Border Conditions; Simulation Analysis; Tantalum Capacitance.Abstract
This article aims to simulate and design the thermal stress during the welding process of tantalum capacitors, which is prone to failure. In this paper, the subsection function is defined, the boundary conditions of thermal stress are set, and the mesh is divided through the temperature diagram of high temperature reflow welding process; Analyze the temperature changes in the welding machine based on time changes, and conduct simulation analysis of thermal stress and cross-sectional analysis of thermal stress. Through simulation results, improve the design structure to minimize the impact of welding process on capacitor failure.
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References
Chen Guanghua. Process optimization and performance study of organic chip solid tantalum electrolytic capacitors[D]. University of Electronic Science and Technology, 2010.
Wang Shuo. Failure mode and analysis of tantalum capacitors [J]. Technology,2018(02):108-109.
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Shao Hongyan. Structural temperature field and temperature stress field analysis [D]. Northwestern Polytechnic University, 2001.
Yang Shiming and Tao Wenquan. Heat Transfer (4th edition) [M]. Higher Education Press,2006-8.
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