Semiconductor Wafer Defect Detection Based on Machine Learning
DOI:
https://doi.org/10.62051/wr098130Keywords:
Semiconductor Wafer; Defect Inspection; Machine Learning.Abstract
Semiconductor wafers are widely used in integrated circuit chips. Because of the complex production process, it is easy to cause various defects. Therefore, the defect detection of semiconductor wafers is an important means to ensure their yield and productivity. This paper mainly expounds on the detection method of wafer defects combined with the machine vision algorithm, including the CNN model, and the classification of the learning-based methods. Current problems and future prospects for total crystalline circle defect detection are discussed in the end.
Downloads
References
[1] Kaempf U. The binomial test: A simple tool to identify process problems[J]. IEEE Transactions on semiconductor manufacturing, 1995, 8(2): 160-166.
[2] Bollmann W. Crystal defects and crystalline interfaces[M]. Springer Science & Business Media, 2012.
[3] Tang B, Kong J, Wu S. A review of machine vision surface defect detection[J]. Chin. J. Image Graph, 2017, 22(12): 1640-1663.
[4] Chen X, Chen J, Han X, et al. A light-weighted CNN model for wafer structural defect detection[J]. IEEE access, 2020, 8: 24006-24018.
[5] Simonyan K, Zisserman A. Very deep convolutional networks for large-scale image recognition[J]. arXiv preprint arXiv:1409.1556, 2014.
[6] Howard A G, Zhu M, Chen B, et al. Mobilenets: Efficient convolutional neural networks for mobile vision applications[J]. arXiv preprint arXiv:1704.04861, 2017.
[7] Lei L J, Sun S L, Xiang Y K, Sun Y and Liu H K. 2020. Bottleneck problem of computer vision application in intelligent manufacturing. Journal of Image and Graphics, 25(07): 1330-1343.
[8] Piao M, Jin C H, Lee J Y, et al. Decision tree ensemble-based wafer map failure pattern recognition based on radon transform-based features[J]. IEEE Transactions on Semiconductor Manufacturing, 2018, 31(2): 250-257.
[9] Yu J B, Lu X L and Zong W Z. 2016. Wafer surface defect detection and identification based on dynamic integration of local and nonlocal linear discriminant analysis and gaussian mixture model. IEEE/CAA Journal of Automatica Sinica, 42(1): 47−59.
[10] Taha K, Salah K, Yoo P D. Clustering the dominant defective patterns in semiconductor wafer maps[J]. IEEE Transactions on Semiconductor Manufacturing, 2017, 31(1): 156-165.
[11] Kong Y, Ni D. A semi-supervised and incremental modeling framework for wafer map classification[J]. IEEE Transactions on Semiconductor Manufacturing, 2020, 33(1): 62-71.
Downloads
Published
Conference Proceedings Volume
Section
License

This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.







