Wei, Xinlei, Guoqing Cai, Shaoyang Zhu, and Guoqing Mei. “Study on Microstructure Formation and Numerical Simulation of Cu-Sn Alloy in Ultrasonic-Assisted Laser Soldering Process”. International Journal of Materials Science and Technology Studies 4, no. 1 (August 6, 2025): 29–39. Accessed April 21, 2026. https://wepub.org/index.php/IJMSTS/article/view/5641.