WEI, Xinlei; CAI, Guoqing; ZHU, Shaoyang; MEI, Guoqing. Study on Microstructure Formation and Numerical Simulation of Cu-Sn Alloy in Ultrasonic-Assisted Laser Soldering Process. International Journal of Materials Science and Technology Studies, U.K., v. 4, n. 1, p. 29–39, 2025. DOI: 10.62051/ijmsts.v4n1.03. Disponível em: https://wepub.org/index.php/IJMSTS/article/view/5641. Acesso em: 23 aug. 2026.